Semiconductor IC Production – From Silicon To Packaged Chip

 

By Dr Holly Ott

Date : 19^th April 2011 ( 1 Day )

Location : Singapore

Who Should Attend : This course is suitable for both engineer and non-engineer ( sales/marketing engineer, finance officer, human resource officer, government officer ) who need an overview of the IC production process in 1 day.

Cost Fee : S$400 per person

Course Description

 This course is designed to give a friendly but comprehensive view of the semiconductor IC production for anyone already working in any one part of IC production, for newcomers to the field, or for support staff (Sales & Marketing, Assembly & Packaging, HR or Finance) in a semiconductor firm.  It covers the very basics of semiconductor devices, the essentials of front-end wafer fabrication and back-end assembly, and include critical topics such as quality, masks, and technologies.  With this framework as a reference, each individual contributor can better understand their role and impact in the entire process, and use this framework to improve their performance and productivity, to facilitate communication with upstream and downstream partners, and to have a better appreciation for this fascinating industry.

 

COURSE OUTLINE

Semiconductor Theory and Basic Device Operations

Review of semiconductor material properties, doping, P-N junctions, diode operation, MOSFET operation, BJT operation, and overview of IC design

 

Semiconductor Technologies

Device dimensions, critical feature size, design rules, CMOS, BiPolar, III-V technolo-gies, Power Devices.

 

Wafer Fab: Cleanroom Concept

Overview of the wafer fab, Front-End and Back-End processes, cleanroom concept, wafer sizes 

 

Front End Processing

Overview of thin film deposition, photolithography, etch, implant, CMP

 

Mask Engineering

What is a mask set, role in product development, mask making 

 

Line Monitoring

Overview of defect monitoring, in-line electrical test, metrology, and final wafer test 

 

Quality and Reliability

Typical FE quality and reliability issues, reliability monitoring, lot dispostition, process

change management.

 

Back End Assembly

Assembly stages: pre-assembly, chip mounting, encapsulation, test, modules, silicon-in-

package.

 

Technology Trends

Overview of current technology trends and new growth areas of electronics

 

About Dr Holly Ott

Holly holds a Ph.D. in Electrical Engineering in semiconductor material characterization and device modeling and has worked for twelve years in semiconductor production in the USA, Europe and Asia for JVs with Siemens, Motorola, IBM and Infineon.  Most recently she played a key role in the transfer of Infineon's wireless operations from Germany to Singapore.  Her work has been in the areas of device simulation and matching, volume electrical and reliability testing, and operations and supply chain management.  Currently, Holly is an adjunct professor in the business schools at Singapore Management University and at SIM University in Singapore.  Previously she has taught in the Electrical Engineering department at Virginia Commonwealth University and has developed and taught a variety of technical and non-technical training programs for Infineon Technologies which have been used regularly for staff development throughout Asia and Europe.  She is active with the Singapore Semiconductor Industry Association to support training and development needs for semiconductor companies in Singapore.

 

Please register online at www.spyrotechnology.com.